ConferenceEngineering
International Conference on Electronics Packaging and Assembly Engineering
Event Starts
140Days
05Hours
59Minutes
10Seconds
IC-EPAE
Fri, Oct 23, 2026- Sat, Oct 24, 2026
Ashdod, Israel
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Oct 3, 2026
IC-EPAE
Fri, Oct 23, 2026- Sat, Oct 24, 2026
Ashdod, Israel
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Oct 3, 2026
Objective of the Conference
The main purpose of International Conference on Electronics Packaging and Assembly Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Important Dates
Start Date
Friday, October 23, 2026
End Date
Saturday, October 24, 2026
Registration Deadline
Thursday, October 8, 2026
Submission Deadline
Saturday, October 3, 2026
Conference Agenda
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
Organizer
