Hum Yan Chai
University Tunku Abdul Rahman
Malaysia
ConferenceEngineering And Technology
International Conference on Electronics Packaging and Assembly Engineering
Event Starts
49Days
09Hours
06Minutes
28Seconds
IC-EPAE
Sat, Jul 25, 2026- Sun, Jul 26, 2026
Los Angeles, United States
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Jul 5, 2026
IC-EPAE
Sat, Jul 25, 2026- Sun, Jul 26, 2026
Los Angeles, United States
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Jul 5, 2026
Objective of the Conference
The International Conference on Electronics Packaging and Assembly Engineering became one of India's largest non-profit professional bodies dedicated to advancing research in the field of engineering and technology. In this regard, ASAR conducts conferences and workshops and publishes high-quality peer-reviewed journals. It aims to promote technical revolution among the present generation to shape the future of the world.
Important Dates
Start Date
Saturday, July 25, 2026
End Date
Sunday, July 26, 2026
Registration Deadline
Friday, July 10, 2026
Submission Deadline
Sunday, July 5, 2026
Conference Agenda
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
