Event Starts
IC-EPAE
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Sep 17, 2026
IC-EPAE
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Sep 17, 2026
The main purpose of International Conference on Electronics Packaging and Assembly Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Start Date
Wednesday, October 7, 2026
End Date
Thursday, October 8, 2026
Registration Deadline
Tuesday, September 22, 2026
Submission Deadline
Thursday, September 17, 2026
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
The Urban Hotel Ndola
Golf Estate, Ndola,
Zambia
Ndola, Zambia
Engineering in Zambia
Lusaka, Zambia
Kitwe, Zambia
Ndola, Zambia
Lusaka, Zambia
Get curated alerts for upcoming events, paper deadlines, and early-bird registrations delivered straight to your inbox.