Dr. Taimoor Khan
National Institute of Technology Silchar
India
ConferenceEngineering And Technology
International Conference on Thermal Conductivity and Material Engineering
Event Starts
16Days
03Hours
35Minutes
28Seconds
ICTCME
Mon, Jun 22, 2026- Tue, Jun 23, 2026
Prague, Czech Republic
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Jun 2, 2026
ICTCME
Mon, Jun 22, 2026- Tue, Jun 23, 2026
Prague, Czech Republic
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Jun 2, 2026
Objective of the Conference
The main purpose of International Conference on Thermal Conductivity and Material Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Important Dates
Start Date
Monday, June 22, 2026
End Date
Tuesday, June 23, 2026
Registration Deadline
Sunday, June 7, 2026
Submission Deadline
Tuesday, June 2, 2026
Conference Agenda
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
