Event Starts
ICTFEMA
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Aug 12, 2026
ICTFEMA
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Aug 12, 2026
The main purpose of International Conference on Thin Films Engineering and Materials Applications is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Start Date
Tuesday, September 1, 2026
End Date
Wednesday, September 2, 2026
Registration Deadline
Monday, August 17, 2026
Submission Deadline
Wednesday, August 12, 2026
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
Vittoria Suites
Milimani, Kisumu,
Kisumu, Kenya
Kisumu, Kenya
Engineering in Kenya
Mombasa, Kenya
Kisumu, Kenya
Kisumu, Kenya
Mombasa, Kenya
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