Event Starts
ICTIMA
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Aug 12, 2026
ICTIMA
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Aug 12, 2026
International Conference on Thermal Interface Materials and Applications is an organization dedicated to support professionals across all fields and countries through strategically designed activities, including international conference organization and journal publications. It also provides access to critical resources and aids global policymaking. It ultimately aims to facilitate learning, networking, and innovation for faculty, students, professionals, and policymakers from any domain.
Start Date
Tuesday, September 1, 2026
End Date
Wednesday, September 2, 2026
Registration Deadline
Monday, August 17, 2026
Submission Deadline
Wednesday, August 12, 2026
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
The St. Regis Chengdu
99 Ti Du Jie,
Qingyang Qu,Chengdu,
Sichuan Sheng,
China,610016
Chengdu, Sichuan, China
Engineering in China
Shanghai, China
Shanghai, China
Shanghai, China
Shanghai, China
Get curated alerts for upcoming events, paper deadlines, and early-bird registrations delivered straight to your inbox.